AMAT의 AGS 사업부 수장 Tim Deane이 JPM TMT 컨퍼런스에서 풀어놓은 30분. 매출의 20%지만, 진짜 알파가 숨어있는 곳을 짚었다.
스크립트 한 줄 한 줄 뜯어서, AMAT 딥다이브 중인 투자자가 '엇, 이거!' 할 만한 신호들만 골랐습니다. 각 카드를 클릭하면 원문 인용 + 왜 중요한지가 펼쳐집니다.
Tim이 "at least one case"라며 슬쩍 흘린 디테일. 어느 customer가 다른 customer가 짓다 만(혹은 완공한) fab shell을 통째로 인수해 자기 제품 라인을 집어넣고 있다는 것. AI capacity 확보를 위한 비대칭 행위.
• 누가 누구로부터 사들였는지 추적 가능하다면 alpha. Intel의 Ohio/Arizona 유휴 shell, Samsung Texas 등이 후보군.
• AMAT 입장에선 즉시 매출 — 빈 shell에 장비가 들어가는 속도가 빠르기 때문. Greenfield보다 훨씬 빠른 ramp.
• Brownfield/repurpose 흐름이 시장 컨센서스(greenfield 중심)에 안 잡혀 있다는 함의.
HBM/DRAM 수요 폭발에 대응하기 위해 NAND 팹을 DRAM 팹으로 전환하는 케이스를 언급. 누구일까? Micron(레만/싱가포르?) 또는 Hynix(M16?)가 가장 가능성 높음.
• NAND wafer start가 줄어드는 이유 중 하나(컨버전 손실). NAND CAPEX 약세 = 의도된 결과.
• DRAM 시장 공급 회복이 빠를 수 있다는 시그널 — greenfield 기다리지 않아도 됨.
• AMAT 입장에선 컨버전 = 신규 장비 매출 + AGS 서비스 더블 히트.
Tim이 직접 언급. "this morning, we announced that Broadcom is joining the EPIC platform as well. They're specifically interested in advanced packaging."
기존 EPIC 라인업: Samsung · Micron · Hynix · TSMC · Advantest + RPI · ASU · Stanford. 여기에 AVGO 추가.
• AVGO가 advanced packaging in-house 역량 구축 중이라는 신호 — 기존 TSMC CoWoS 의존도 분산 전략.
• ASIC 진영(AVGO)이 HBM/패키징 supply security 위해 patient capital을 EPIC에 투입. 향후 5년 packaging 공급 그림 재편 가능.
• AMAT 입장: 10년 R&D 사이클을 5년으로 단축하는 ecosystem effect. AGS service intensity도 동반 상승.
• 페어 트레이드 아이디어: AVGO + AMAT vs CoWoS-only exposure.
NAND 투자가 부진해 보이는 이유의 핵심: bit leverage가 미쳤다. SLC NAND 대비 HBM 1웨이퍼 40~50x, QLC NAND로 가면 그 4배(=160~200x).
• NAND wafer start 감소 = 산업 위축이 아닌 'bit per wafer 폭증'에 따른 자연스러운 조정.
• NAND CAPEX 약세를 'AI 수요 부진'으로 잘못 해석하는 컨센서스 반박 가능.
• Greenfield NAND는 over time 다시 온다고 Tim이 명시 — Cyclical low 신호.
구 컨센서스: leading-edge logic 1/3, memory(DRAM+NAND) 1/3, ICAPS 1/3. 이게 깨졌다. Tim은 2026 incremental의 80%가 advanced logic + DRAM + advanced packaging 세 곳이라고 명시.
• 이 세 영역 모두 AMAT가 #1 점유율. 구조적 share gain 환경.
• ICAPS는 "3~6개월 전 대비 incrementally positive, China/non-China 모두 flat to up". 다이 사이즈 큰 ICAPS 우려 완화 신호.
• Lam(NAND etch 중심) vs AMAT(logic/DRAM/packaging) 상대 성과 격차 정당화.
Integrated Materials Systems(IMS)가 4개 platform으로 운영 중:
① Trillium — gate formation
② Epi + Etch combo — contact formation
③ Copper barrier integrated — super tight lower layers
④ Copper barrier integrated — mid-layers (다른 config)
• 7-process 통합 = 경쟁사가 흉내 못 내는 moat. Wafer를 ambient에 노출 안 시키는 것이 advanced node에서 점점 결정적.
• AGS service intensity 자동 상승 — 7가지 다른 화학공정 = 7배 다른 parts/training/diagnostics. ASP뿐 아니라 lifetime service value도 더 높음.
• Trillium은 '최근 3개월 출시 5개 신제품' 중 하나로 다시 언급됨.
지난 어닝에서 회사가 강조했던 8분기 이상 visibility를 Tim이 재확인. 그러면서 명시적으로 "이번은 expected ramp"라고 못박음.
• Post-COVID는 unexpected → 공급망 카오스 → 과잉 발주 → bust 이어짐. 이번은 visibility 기반 발주라 violent reversal 확률 낮음.
• Agentic AI를 demand driver로 처음 공식 거론 — inference 인프라가 WFE까지 침투했다는 시그널.
• '27~'28도 강한 성장 = AMAT가 처음으로 multi-year strong outlook을 qualitative하게 가이드.
CFO Brice가 어닝에서 언급. Tim은 그 mix를 detail함: greenfield의 핵심은 advanced logic + DRAM. Advanced packaging도 greenfield 성격 강함(front-end → back-end로 공간 이동 필요).
• "Not enough physical capacity" — 즉 brownfield 컨버전으로도 부족할 만큼 수요가 강함. 강력한 demand signal.
• NAND는 'upgrade 중심', 다른 셋은 'greenfield 중심'으로 명확히 구분됨. 투자 모델링 시 이 구분 반영 필요.
AGS 안에 software franchise가 있고, MES(Manufacturing Execution System), Smart Factory, SIM 시스템에서 AMAT가 최대 공급자라는 사실. 이건 정말 잘 안 알려진 자산.
• Agentic AI를 팹 운영에 침투시키는 entry point — MES가 곧 AI agent의 '손'이 됨. Tim이 직접 "engage in different ways than we have in the past"라고 언급.
• Pure-play SaaS 회사들과 다른 multiple framework 적용 가능 — 시장이 still 장비주로만 가치평가.
• AGS 갱신율 90%+의 stickiness가 software 영역까지 확장되면 ARR 모델로의 진화 가능.
2/3가 long-term contract. 평균 length 2.9년이 sweet spot. 기본 warranty 서비스보다 managed/performance(outcome-based) 갱신율이 훨씬 더 높음.
• Outcome-based 서비스로 mix shift는 gross margin accretive + retention 강화 동시 효과.
• 10~12년 전 결정한 pivot이 이제 본격 결실 — 후발주자가 follow하기엔 customer integration depth가 너무 깊음.
Process window가 advanced node에서 너무 좁아짐. 한 번의 corrective maintenance가 edge die yield를 망칠 수 있음. AMAT는 CROSSMATCH라는 quick tool fingerprinting capability를 BU와 함께 automate.
• 'Predictive scheduling + 빠른 re-centering' = 고객 입장에선 wafer당 손실 최소화. AI 시대 'good die out' 압박과 정확히 부합.
• AIx 플랫폼(Actionable Insight Accelerator)의 실제 작동 메커니즘 공개 — KLA의 process control과는 다른 angle.
AGS 인프라가 이미 $6.5B run-rate. 추가 capa 증설 없이 throughput만 늘려서 OPM 끌어올리는 구조. DC 3곳 fully automated, 60% touch-free.
• AGS OPM 29% → 30%+ 가시화. 매출 늘면 자동으로 operating leverage.
• 향후 incremental 매출 1$당 contribution margin이 매우 높음 — 그래서 가이던스 mid-teens 상향에도 sustainable 한 것.
• 'CapEx-light infrastructure'라는 점은 ROIC 측면에서도 의미 있음.
Tim이 직접 강조. Trillium(gate formation IMS), selective nitride deposition(precision tool), Veeva treatment tool 등 — Master Class에서 다뤘던 것들.
• System gross margin 55%, OPM 35%의 sustainability를 뒷받침.
• Advanced node로 갈수록 AMAT 차별화 capability 증가 = unique value selling power.
• 6월 25일 DRAM/Advanced Packaging Master Class 예고 — 추가 product disclosure 기대.
전통적으로 front-end 장비/back-end 장비는 분리. 하지만 heterogeneous integration이 진행되면서 front-end 수준의 정밀도/clean room/material engineering이 back-end로 침투 중. AMAT의 front-end DNA가 packaging service에서 직접 leverage됨.
• AMAT가 packaging에서 HBM #1, 3D SoIC 강자라고 명시. 이 둘이 advanced packaging의 가장 빠르게 성장하는 두 영역.
• ASMPT/BESI 등 전통 back-end 강자들이 follow하기 어려운 영역 — 30년 front-end 경험을 그대로 service revenue로.
• AMAT의 packaging exposure 가치를 SOTP에서 별도로 가산할 근거.
딱딱한 직역이 아니라 한국 자산운용사 투자운용역이 읽는 톤으로 풀었습니다. 영문 원문 토글로 원본 confirm 가능.
좋은 아침입니다. JPM 54회 TMT 컨퍼런스 셋째 날에 오신 것을 환영합니다. 저는 반도체·반도체 장비 담당 애널리스트 Harlan Sur입니다. 오늘은 AMAT의 Tim Deane SVP를 모시게 되어 영광입니다.
Tim은 AGS(Applied Global Services) 사업부를 이끌고 있습니다. AGS는 AMAT 전체 매출의 약 20%를 차지하지만, 안정적이면서도 고성장하는 서비스 프랜차이즈로, 회사가 글로벌 반도체 제조사들에 제공하는 systems-level 솔루션의 핵심 축입니다.
Tim은 AMAT에서 30년 넘게 근무했고, 지난 3년간 AGS를 책임지고 있습니다. 그 전엔 Semiconductor Systems Group에서 25년 이상 — field operations, business management, strategy, customer planning — 다양한 영역을 거쳤습니다. Tim, 와주셔서 감사합니다.
All right. Good morning, everyone, and welcome to the third day of JPMorgan's 54th Annual Technology, Media and Communications Conference. My name is Harlan Sur. I'm the semiconductor and semiconductor capital equipment analyst for the firm. Very pleased to have Tim Deane, Senior Vice President at Applied Materials. Tim heads up Applied's Global Services business, what we call AGS, represents about 20% of Applied's overall revenues, drives a stable, but very high-growth services franchise, which is a key part of the systems-level solutions they develop and deploy to the world's leading semiconductor manufacturers.
Tim has been with Applied for over 30 years, in charge of AGS for the past 3 years and previously worked in the Semiconductor Systems Group for more than 25 years, leading the field operations team, business management, strategy and customer business and planning team. So Tim, thank you very much for joining us this morning.
네, 반갑습니다 Harlan. 감사합니다.
Yes. Nice to be here, Harlan. Thanks.
high-level부터 시작하죠. 지난주 회사가 매우 강한 실적과 가이던스를 발표했습니다. 시스템 사업 성장 가이던스를 기존 20%에서 30%로 상향했죠.
지난 90일 사이에 incremental upside가 어디서 온 건지 궁금합니다. (a) 신규 greenfield 팹이 앞당겨진 건지, (b) 기존 capa에서 customer들이 technology migration을 가속화하는 건지, 아니면 (c) 그냥 plan을 확정하면서 tool slot을 lock-in하는 건지?
그리고 어떤 end market — advanced foundry/logic, DRAM, advanced packaging — 이 incremental improvement에 가장 크게 기여했나요?
We're going to start off at a high level. The team just reported very, very strong results and growth outlook last week. So I'm going to start off there, but we are going to touch upon Tim's AGS franchise because it's just — it's a great ratable, highly profitable cash flow generative franchise. But starting off at a high level, team reported strong results outlook last week.
On the better revenue growth outlook for this calendar year, I think you guys are now calling for 30% growth in your systems business versus your prior growth outlook of 20%. On the incremental upside this year, is it being driven by new brick-and-mortar greenfield programs being pulled forward? Or are customers just accelerating technology migrations on existing capacity? Or just solidifying plans and now sort of locking in sort of tool slots, right?
And so trying to figure out like what drove that sort of incremental upside over the last 90 days? And then can you just talk about which end markets, advanced foundry logic, DRAM, advanced packaging contributed most to the sort of incremental improvement in the outlook?
좋은 질문입니다. 본질적으로 '27년 capa를 '26으로 pull-in 한 건 아닙니다. 지금 globally 진행 중인 brick-and-mortar greenfield 프로젝트들이 정말 많고, customer가 가능하면 가속화하려는 환경입니다.
그런데 진짜 재미있는 건 기존 공간 안에서 일어나고 있는 creativity입니다. 한 사례를 들면, 어떤 customer가 다른 customer의 완성된 fab shell을 통째로 사들였습니다. 당연히 거기에 자기 제품을 가능한 한 빨리 집어넣겠죠. 우리한텐 좋은 일입니다.
또 다른 패턴은 in-fab 변경입니다. Customer들이 전체 production line을 보면서 throughput bottleneck — 예를 들어 구세대 저효율 장비 — 을 찾아내면, "이 platform 빼고 더 productivity 높은 platform으로 교체하자"는 케이스가 많아지고 있습니다. WFE에는 좋은 일이죠.
그리고 또 다른 사례: 200mm 팹을 셧다운하고 packaging 팹으로 repurpose하는 경우가 있습니다. End market에서 packaging 수요가 너무 강하니까 capa 확보를 위해 customer들이 최대한 창의적으로 움직이는 겁니다.
또 다른 예: 구세대 2D NAND 팹을 DRAM 팹으로 컨버전하는 케이스도 있습니다. DRAM, advanced packaging — 이 두 테마는 계속 반복됩니다. Customer들이 good die를 더 뽑아내려고 하고, 그 창의성이 우리가 보고 있는 incremental upside로 이어지는 겁니다.
서비스 관점에서 한마디 보태자면, AI에 닿는 모든 곳에서 고객들이 우리에게 "팹 output을 어떻게 최적화할 수 있냐"고 묻고 있습니다. 그게 서비스 비즈니스도 끌어올리고 있죠.
Sure, Harlan. Happy to talk about that. So there's — I would say there's not fundamentally a pull-in from '27 into '26. There's a lot of brick-and-mortar being built out there, greenfield facilities. So there's a pipeline of projects that are coming online. To the extent that customers can accelerate them, they obviously want to do it as quickly as possible given the environment. But there's a lot of creativity going on in the existing spaces out in the factories globally today.
There's at least one case where a customer procured a completed shell from another customer. And obviously, they're going to put product into that as quickly as they can, which helps us with our business. But the other areas that we see are primarily in-fab changes. So if customers are looking at their full production lines, if they see pinch points in their production, maybe an older generation tool that's a lower throughput that's limiting the output of the factory, we're seeing lots of cases where customers are coming to us and saying, okay, we're going to remove this platform. We're going to replace that with a higher productivity platform, which is good for wafer fab equipment.
Additionally, we see cases where — or there's at least a case where a 200-millimeter factory was being shut down and repurposed into a packaging factory. So you were asking kind of which areas do we see the growth. Packaging has got intense growth pressure in demand in end markets. So we're seeing customers being as creative again as possible to get capacity in as quickly as possible.
And then we see another example where there's an older generation 2D NAND factory that's being converted to a DRAM factory. Again, DRAM, advanced packaging are kind of themes that you will hear over and over again where customers are trying to get more good die out. So that creativity is leading to these incremental upsides that we see. And then just from a services perspective, interject, as we work with customers across all their facilities, I think in every place that touches AI, those customers are coming to us saying, how can we optimize output for the factory, which is kind of driving the service business as well.
네, 이 부분이 대부분의 투자자들 레이더 밖에 있는 것 같아요. 모두 greenfield capacity, technology migration만 생각하잖아요. 그런데 말씀하신 대로 이미 설치된 capa가 엄청 많고, throughput·yield가 최적화 안 된 곳에서 작은 개선만 해도 customer 입장에선 millions of dollars 단위 매출/수익 임팩트로 이어진다는 거죠.
Yes. I think that's a little bit under the radar screen for most investors is that we all tend to think about greenfield capacity. We all tend to think about technology migration. But as you pointed out, there's a ton of installed capacity out there where throughput may not be as optimized, yield may not be as optimized, right? And any little improvements in current factory throughput or defect density improvements can have a pretty significant impact in terms of output and good die per wafer, which ends up being millions and millions of dollars for their customers, right?
맞습니다. 풀가동 중인 팹에서 utilization 1%p 개선은 productivity 측면에서 어마어마한 lever입니다. Customer들과 파트너십을 맺으면서, 특히 공장 내부에서 — 기존 장비 업그레이드, 핵심 장비 배치 신규, 또는 그냥 서비스 최적화 — 이런 게 다 win-win 시나리오죠. 그래서 지금 customer들과 정말 긴밀하게 일하기 좋은 환경입니다.
No, that's a good point. If a fab is fully installed and that's operating, every percent of utilization improvement that you can make in a factory is a huge lever for productivity for customers. And as we partner with them, particularly in the factories, whether it's with upgrades to existing tools, placements of key tools or just service optimization, these are all kind of win-win scenarios that we see with customers. So it's a great environment out there to be working together really closely.
지난 어닝에서 회사가 역사적으로 가장 높은 visibility — 8분기 이상의 백로그·customer forecast를 갖고 있다고 했죠. 그 덕에 '27·'28 WFE도 강한 성장이 이어질 거라고 qualitative하게 말할 수 있는 confidence가 있었던 거고요.
그리고 Brice가 100개 이상의 프로젝트·프로그램이 레이더에 있다고 했습니다. 다양한 단계 — near-term ramp, longer-term commitment — 가 섞여 있다고요. 일부는 technology migration, 일부는 greenfield build-out일 텐데, 이 100+ 파이프라인의 대략적인 mix가 어떻게 되고, 2~3년에 걸쳐 어떻게 conversion될까요?
And at earnings, the team called out having historically high visibility, 8-plus quarters type of visibility to your backlog, customer forecast. And this gave the team the confidence last week to qualitatively talk about continued strong growth profile in WFE spend '27 and '28, right?
And in line with that, Brice talked about the Applied team having 100-plus projects, programs that are on your radar screen. These projects sit at different stages, some near-term ramps, some longer-term commitments. Some of these programs are technology migration focused, greenfield build-outs. What's the rough mix of this 100-plus project pipeline, right? Is it technology migration more biased? Is it greenfield capacity biased? And how does this pipeline sort of convert over the next, call it, 2 to 3 years?
먼저 8분기 visibility에 대해 한마디. Post-COVID ramp 당시를 겪어본 분들은 아실 텐데, 그때 정말 많은 learning이 있었습니다. 저는 그 시점에 capa planning의 nexus 자리에서 customer들과 일했고요. 그때는 unexpected ramp였습니다. 지금은 expected ramp고요. AI, 그리고 이제 본격적으로 등장하는 Agentic AI 컴포넌트 때문에 leading logic, DRAM, HBM, advanced packaging — 이 모든 곳에서 거대한 수요가 명확히 보입니다.
그래서 공급자와 customer 모두 transition을 smooth하게 만드는 게 mutual best interest고, collaboration이 자연스럽게 일어나고 있습니다. 팹 ramp-up은 굉장히 복잡합니다. 저도 install을 위한 인력을 globally 채용 중이고, customer schedule을 맞춰야 하니까요.
이제 파이프라인 얘기로. 100개는 정말 많습니다. Brice가 최근 10개 이상 추가됐다고 한 것도 맞고요. Greenfield capa의 가장 큰 부분은 advanced logic과 DRAM입니다. 이 두 곳은 지금 물리적인 공간 자체가 부족한 상황이에요. Advanced packaging도 같은 처지인데, 수십 년간 비교적 단순했던 영역에서 front-end 타입 프로세스를 back-end로 가져오면서 물리적 공간이 더 필요해졌기 때문입니다.
NAND는 좀 다릅니다. NAND wafer는 업그레이드 leverage가 어마어마하거든요. 우리는 전 세계 모든 NAND 팹에 들어가 있고, 지난 2~3년간 customer들이 한 세대에서 다음 세대로 컨버전하면서 wafer start가 조금씩 줄어드는 걸 봐왔습니다. 좀 더 복잡한 그림이죠. Wafer start는 줄어드는데 bits는 크게 늘어납니다.
구체적으로 분석을 좀 해봤는데, HBM 웨이퍼 1장 대 SLC NAND 웨이퍼 1장 비교하면 bits 기준 40~50배. QLC로 가면 그게 4배가 됩니다. 그래서 NAND는 컨버전 방식이 customer 입장에서 굉장히 효율적이에요. 시간이 지나면 greenfield NAND도 좀 나올 거라고 보고, 그건 우리한테도 좋은 일입니다. 다만 나머지 3개 영역에서 greenfield leverage가 더 크게 보이는 거죠.
Yes. So just the first part of your question about the 8 quarters visibility, I think — those of us that were around post-COVID during that ramp, there was an awful lot of learning that happened during that period. In my prior role, I was kind of at the nexus of that with Applied working with customers as they were trying to kind of plan capacity on what was kind of an unexpected ramp.
This time, it's a little more of an expected ramp because we know with AI and the Agentic components of AI now that are coming online, there's just huge demand across, in particular, leading logic, DRAM, HBM and advanced packaging. Those are the ones that we see as kind of the primary drivers. So it's in our best interest as a supplier and a customer to collaborate as closely as possible because we want to make these transitions smooth.
Bringing up these factories is extremely complicated. We or me, I'm hiring people across the globe in order to do installs, meeting customer schedules. So the collaboration is coming naturally, I would say, at the moment, particularly with our largest customers because it's in our mutual best interest to do that.
Now on to the pipeline. So when we look at the pipeline, 100 projects is a lot. And I think Brice also mentioned, 10 or more that's come fairly recently. The biggest part of the greenfield capacity that's coming online is actually in the advanced logic and DRAM spaces because there's just not enough physical capacity today. There's so much silicon that's needed for these advanced technologies that it's really being driven by the greenfield space.
I would say advanced packaging is in the same boat, so to speak, just because we're moving from something that's been relatively straightforward for decades, we're moving kind of the front-end type processes into the back end, which is, again, requiring more physical space in the factories.
NAND is a little bit different. You get so much leverage on a NAND wafer whenever you upgrade. So as we're present in all the NAND factories around the world. We see the wafer starts have kind of dropped a little bit over the last couple of years in NAND as customers have converted from one technology to the next. So it's a little more complicated. The technology — the wafer starts drop a little bit, but the bits go up significantly.
So there's a lot more leverage that you get with upgrade NAND as compared to the other spaces. We've done some analysis, a typical, say, HBM wafer versus a NAND wafer, you're getting somewhere between 40 and 50x the bits on kind of apples-to-apples comparison for an SLC NAND. If you go to quad level, you're quadrupling that. So we think there's just a huge amount of capacity, and it's very efficient for customers to do that as conversion. Now I think there will be some greenfield NAND over time, which is great for us. We're very — we're actually kind of excited about that as well. But we just see the leverage in the other 3 spots for greenfield.
반도체 산업이 올해 $1조 매출을 돌파할 트랙입니다. 불과 몇 년 전엔 2030년 $1조 시장을 얘기했었는데요.
최근 Master Class에서 중요한 인사이트를 짚으셨죠. 장기적으로 spending mix는 1/3 leading-edge foundry/logic + 1/3 memory(DRAM·NAND 반반) + 1/3 mature/specialty/analog/power(=ICAPS)로 생각했는데, AI/데이터센터 컴퓨트/네트워킹/메모리가 leading-edge logic과 메모리에 강하게 biased되면서 segment 간 divergence가 커지고 있습니다.
올해, 그리고 향후 몇 년 spending mix를 어떻게 새로 봐야 할까요?
Got it. And semiconductor industry is on track to drive over $1 trillion in revenues this year. I mean it was just a couple of years ago that we were all talking about a $1 trillion market by 2030. And on your recent — these are very valuable sessions, but in your recent Master Class, you brought up an important insight, which that the mix of leading edge — the mix of spending was longer term thought to be 1/3 leading-edge foundry/logic, 1/3 memory, evenly split between DRAM and NAND and 1/3 sort of mature and specialty analog power products, which you guys call your ICAPS business.
But given the rapid growth AI and data center compute, networking and memory, which biases strongly towards leading-edge logic and memory architectures, there's now a strong divergence, it feels like in growth between these various segments. So help us understand like how do you see — is there a new way to kind of think about the mix of spending by markets, not only this year, but over the next kind of few years?
올해 incremental WFE의 약 80%가 advanced foundry/logic, DRAM, advanced packaging — 이 세 영역에 몰려 있습니다. AI 수요가 그 driver예요. Compute → mobile → 이제 AI로 wave가 넘어오는데, 각 wave마다 focus가 다르죠.
ICAPS도 여전히 중요한 시장입니다. Brice도 언급했듯이 3~6개월 전 대비 incrementally positive입니다. China, non-China 모두 flat to up으로 보고 있고요. 다만 spending의 bulk는 그 세 영역에 갑니다. AMAT는 advanced foundry/logic에서 #1, DRAM 여러 영역에서 #1, advanced packaging에서도 #1입니다.
Yes. So for this year, we think about 80% of the incremental wafer fab equipment spending is really in those 3 areas that you talked about, the advanced foundry logic, DRAM and advanced packaging. And that really is driven by the AI demand. If you look at the various waves that have come up over time with compute and then to mobile and now into AI, there are different focuses for each of those areas.
ICAPS is still a very important market for us. And I would say we're — I think Brice made the comment that we're incrementally positive on it compared to where we were, say, 3 to 6 months ago. We think it's kind of flat to up both China and non-China. But the bulk of the spend is really going to be in those 3 focused areas where Applied is #1 in advanced foundry logic. We're #1 in kind of DRAM in a lot of areas and then also for the advanced packaging.
최근 Master Class에서 transistor·interconnect 아키텍처를 다뤄주셨는데, 큰 differentiator 중 하나가 IMS(Integrated Materials Systems)죠. Gate formation, interconnect formation의 여러 step — surface treatment, etch, deposition, clean, anneal, integrated metrology 등 — 을 한 platform에서 통합하는.
지금 IMS가 전체 시스템 매출의 약 30%인데, IMS의 benefit이 technology enablement뿐 아니라 더 낮은 defectivity, 더 높은 throughput, 더 작은 footprint 등 분명한데도 IMS mix가 최근 몇 년간 크게 늘지 않은 이유는 뭔가요? 그리고 IMS가 AGS에는 어떤 기회를 만드나요?
Again, going back to the — you guys held a great Master Class on transistor and interconnect architectures, right, on current and next-generation platforms. One of the big differentiators in my view, at the transistor level is Applied's what you guys call integrated material systems, right? So various aspects of the gate formation or the interconnect formation, you've got a tool that integrates up to like 7 different processes into a single platform, right, surface treatment, etch, deposition, clean, anneal, integrated metrology and so on, right? And these integrated solutions now represent about 30% of Applied's overall system sales. Obviously, the benefits of IMS is not only technology enablement, but as you could appreciate, better defectivity, better — higher throughput, lower overall system footprint, it seems like a big differentiator for Applied, but why is it that the mix of IMS-based platforms hasn't increased that much over the past several years? And how does IMS create opportunities for your AGS franchise?
IMS는 정말 AMAT만의 unique한 무기입니다. 넓고 connected portfolio가 있고, 이걸 single mainframe으로 묶어서 wafer를 ambient에 노출하지 않고 처리할 수 있는 능력이 critical한 영역들이 있어요.
Master Class에서 IMS platform 4개를 다뤘는데:
① Trillium — gate formation
② Epi + Etch combination — contact formation
③ Integrated copper barrier — super tight lower layers
④ Integrated copper barrier — mid layers
AMAT 관점에서는 customer와 가능한 한 긴밀하게 일하면서 integrate할 가치가 있는 step만 integrate합니다. Single platform 복잡도가 올라가니까요. 예전엔 단일 PVD platform Endura였던 게 이제 7개 다른 application이 들어가는 platform이 됐어요. 그 platform을 production에서 관리하고, redundancy 챙기고 — 이런 게 truly critical한 step에서만 의미가 있죠.
또 다른 큰 piece는 application co-optimization입니다. 순차적이든 비순차적이든, 여러 layer를 가로질러 interact하기 때문에 co-optimize가 필요한 step들이 있죠. 좋은 예가 PDC 그룹, metrology/inspection 그룹, development 팀 간 synergy인데, 특히 PROVision으로 wafer 전체에 수천 개 measurement를 하면서 process를 과거보다 훨씬 빠르게 최적화하고 있습니다.
그래서 holistic하게 봅니다. Customer가 원하고 의미가 있으면 integrated platform을 만들고, 그렇지 않으면 co-optimization을 통해 flexibility를 주는 식이죠. IMS mix를 늘리는 게 목표가 아니라 flow에서 optimal한 공간을 찾는 게 핵심입니다. 이게 AMAT가 다른 회사와 진짜로 다른 영역이에요 — 여러 product line에 걸친 capability 때문에.
That's right, IMS. Sure. So I do think IMS is one of the things that's really — it's unique for Applied Materials, right? We have a very broad connected portfolio of products. And the ability to bring them together into a single mainframe where you don't break back and you don't expose the wafer to ambient is, in some cases, it's very critical. I think in that Master Class, if I counted correctly, there were 4 IMS platforms that we talked about, right?
There was Trillium that you mentioned for gate formation. There was an Epi and etch combination for forming the contact that was talked about and then 2 versions of copper berries integrated tools for the super tight pack lower layers is one configuration and then kind of the mid-layers is another configuration. So from Applied's perspective, we will work with customers as closely as possible to integrate steps that make sense to integrate because it does drive complexity on a single platform, as you can imagine. What used to be a single PVD platform Endura now is a 7 different applications. So managing that platform in production and just kind of redundancy on the platform, you want to optimize for where that's really needed. And it's really these absolutely critical steps that we do that.
The other thing we do at Applied, again, because of the portfolio is we co-optimize applications. And that's another big piece of the business. So they can be sequential steps or nonsequential steps that still need to be co-optimized because they interact across multiple layers. I think a good example of this is we're seeing great synergy between our PDC group, our metrology inspection group and our development teams, in particular with PROVision, where you can do thousands of measurements across the wafer, we can optimize processes faster than we have in the past.
So we tend to look at it pretty holistically, where it makes sense to do an integrated platform with a customer, if that's the demand, then we will do it. And we are constantly co-optimizing applications kind of into the flow where it makes sense to give the customer a little more flexibility. So it's not really about increasing that number. It's really finding the optimal space in the flow. But again, I think this is one of the areas where Applied is truly unique in the industry because of all these capabilities that we have across different product lines.
시스템 복잡도가 올라가면 그걸 supporting하는 service 조직에도 좋은 일이죠. IMS platform들의 service intensity가 더 높은 게 맞나요?
And complexity — system complexity in my mind, means good things for the services organization that supports that. Is that a fair — is the service intensity a bit higher on these IMS platforms?
네, 맞습니다. Parts만 봐도 그렇죠. 7~9 chamber Endura가 전부 PVD였다면 parts에 commonality가 많아요. 그런데 이제 ALD, anneal, CVD, PVD가 다 들어가면 unique capability들이 섞이는 거고, 그러면 customer를 support하는 방식 자체가 달라집니다. 그 tool들이 maximum output을 내려면요.
The service intensity is higher on the IMS platforms for the reasons that you stated. If you think about — just think about parts, if you had a 7 or 8 chamber, 9-chamber Endura that was all PVD, there's a lot of commonality in the parts. If now you have an ALD and an anneal and you got CVD and PVD, those are all kind of unique capabilities. So it causes us to prepare differently with customers to support those tools to make sure they're getting maximum output in the factory.
지난 분기 DRAM 매출이 $1.7B, YoY +18%였죠. 지난 10년간 WFE 기준 DRAM share를 약 10%p 끌어올렸고요. 향후 2~3년 DRAM 로드맵이 AMAT한테 굉장히 의미있는데, 6F²가 ramp 중이고 next-gen 4F², 결국 3D DRAM으로 갑니다. AMAT는 4F², 3D DRAM에서 materials intensity가 의미있게 올라간다고 일관되게 말해왔고요.
지금 6F²에서 AMAT 위치 대비 4F²에서의 share opportunity를 어떻게 봐야 하나요? Historical track record 보면 또 3~5%p 추가 share gain이 가능한 시점인가요?
Your DRAM revenues were $1.7 billion in the most recent quarter, up 18% year-over-year. The team has roughly gained 10 percentage points of WFE-related DRAM share over the last decade. The next 2- to 3-year DRAM road map is meaningful for Applied, right? 6F-squared continues with its high-volume ramp on the next-generation 4F-squared and then eventual move to 3D DRAM architecture, Applied has been pretty consistent that materials intensity increases meaningfully at 4F-squared and especially at 3D DRAM. Can you just frame for us the share opportunity for Applied in 4F-squared specifically versus where you sit today at 6F? And is the right way to think about it, given the historical share gain track record that maybe Applied gains another, call it, 3 to 5 percentage points of WFE DRAM share at these upcoming inflection points?
먼저 Master Class 광고 좀 할게요. 6월 25일에 DRAM + advanced packaging Master Class를 합니다. Advanced foundry/logic 때 보여드린 디테일 수준으로요.
6F²은 runway가 많이 남았습니다. Customer들이 이 기술을 계속 밀어붙이고 있어요. (다음 세션 발표자) Manish가 곧 올 텐데 end market 수요가 어마어마하다는 얘기를 할 거예요.
기술이 있으면 가능한 한 오래 extend하고 싶잖아요. 6F² 로드맵이 가는 방향이 정확히 AMAT portfolio의 sweet spot입니다. 더 advanced한 wiring이 들어오고, transistor formation이 몇 년 전 advanced foundry/logic으로 갔던 그 방식으로 이동 중이에요. 그래서 그쪽에서 쌓은 지식·tool 경험·productivity 개선·cost down benefit을 DRAM으로 가져올 수 있습니다.
4F²과 3D DRAM으로 가면, materials engineering intensity도 AMAT 영역으로 확실히 이동합니다. 그래서 EPIC platform을 만든 거예요. 이미 발표한 customer만 해도 Samsung, Micron, Hynix, TSMC(지난주). Advantest도 partner로 합류했고요. 대학들도 — RPI, ASU, Stanford — 들어와 있습니다. 그리고 오늘 아침, Broadcom이 EPIC platform에 합류한다고 발표했어요. AVGO는 specifically advanced packaging에 관심이 있고요.
지금 이 process들이 너무 복잡해서 ecosystem이 있어야만 시장에 가져올 수 있습니다. 그래서 EPIC이라는 vehicle에 partnering하는 게 가속의 길이라는 인식이 생긴 거고요. 우리 목표는 10년짜리 development pipeline을 절반으로 줄이는 것 — innovator, customer, customer의 customer, 산업 파트너가 모두 같은 시설에 있고 co-optimize하는 환경에서.
서비스 관점에서 이건 사상 최고의 일이에요. 과거엔 우리 시설에서 wafer 몇 장, chiplet 몇 개로 데모를 했다면, 이제는 customer와 같은 facility에서 AIx capability, eco solution을 둘러놓고 process를 develop하는 겁니다. Service 인력이 거기서 brand-new tool에 대한 fingerprint를 만들기 시작하고, customer가 R&D 시설에 그 tool을 가져가면 즉시 fingerprint해서 더 빨리 ramp해줄 수 있죠. Speed to market을 increase.
그러니까 upfront R&D pure research부터 R&D 시설을 거쳐 HVM(고객 양산) 시설까지의 전체 ecosystem play입니다.
Yes. So let me start by putting a little plug in for Master Class because on June 25, we are going to do a DRAM advanced packaging masterclass, kind of the level of detail that you saw with the advanced foundry logic. With 6F-squared, in particular, we see there's a lot of runway. Customers are pushing those technologies. Again, the demand — Manish is coming up next. I'm sure he's going to talk about the demand in the end markets is pretty incredible.
So when you have a technology, you want to extend it as long as you can. And the place where we see the road map going for 6F-squared is really right into the sweet spot for Applied's portfolio. There's going to be more advanced wiring. We also see that the transistor formation is moving more to the advanced style that kind of moved into advanced foundry logic a few years ago. So we're able to take that knowledge, the experience on the tools, the productivity and cost down benefits that we've seen by optimizing those tools and move those into the DRAM into the next couple of years.
When we start talking about 4F-squared and 3D DRAM, again, we just — we see that the materials engineering intensity on those applications going forward is also moving into the Applied space. And this is one of the fundamental reasons why we created this EPIC platform. So we've announced a number of customers, Samsung, Micron, Hynix, TSMC last week. Advantest is joining as a partner. We have universities coming in, RPI, ASU and Stanford. And just this morning, we announced that Broadcom is joining the EPIC platform as well. They're specifically advanced packaging — they're specifically interested in advanced packaging.
And these processes today are so complicated, it takes an ecosystem to essentially bring these to market. So I think there's recognition that partnering in this vehicle, which is EPIC for Applied is going to be a way to accelerate that. And our goal is to take what was a 10-year development pipeline and ultimately cut it in half by bringing everybody into the same facility and co-optimizing in an environment where the innovator is there, the customers are there, the customers' customers are there, industry partners are there, just to fundamentally change the way that development is done.
And from a service perspective, I view this as the best thing ever because historically, when we've done development with customers, we've done a demo in our facilities, a couple of wafers or chiplets. Now we're going to be developing a process with a customer in a facility where we can put our AIx capability around it, our eco solutions around it. We'll have our service folks there working on developing a fingerprint on these brand-new tools so that when a customer puts it into their R&D facility, we can fingerprint it immediately, bring it up faster, increase speed to market for customers.
So it's a whole ecosystem from the upfront R&D process pure research, all the way through how do we optimize it and get it up into production faster for customers in their R&D and ultimately in the HBM facilities.
네, 이제 AGS 서비스 프랜차이즈로 focus 옮겨봅시다. 주요 customer 모두와 contact 중인 분이시잖아요. 지금 customer들의 priority가 뭐고, AMAT 팀은 어떻게 도와주고 있나요?
Yes. No, I think now is actually a great time. So let's focus on your AGS, your services franchise. As the Head of Applied Services business, you're in contact with all of your major customers. I mean what are their priorities right now? And how is the Applied team helping them out?
한 단어로 말하면 'output' — good die out입니다. 개별 tool throughput 최적화가 아니라, 말 그대로 every single wafer에서 good die를 더 뽑는 것.
AGS가 10년 동안 키워온 capability를 활용하고 있어요. 특히 AIx 플랫폼(Actionable Insight Accelerator). AI, predictive model, digital twin, recipe optimizer를 customer 팩토리의 tool에 가져다주는 방식입니다.
Project base, contract base로 긴밀하게 일하며 output 최적화, 특히 good die out 최적화에 집중합니다. 오늘 AGS 매출의 2/3가 장기 계약이라서 customer와 tight한 관계를 유지하고 있고, customer들은 우리가 팹에 깔아둔 footprint를 leverage해서 output을 끌어올리고 있죠.
So the priority — in a word, priorities are output. It's good die out. And so it's not just optimizing throughput on an individual tool. It's literally optimizing good die out on every single wafer. So we're leveraging some of the capabilities that we've been developing over the last 10 years in AGS, specifically the AIx platform, which is actionable insight accelerator. This is the way that we bring AI, predictive models, digital twins, recipe optimizers.
This is the way that we bring these to customers in the factory on their tools. So we're working very closely with them on a project basis and a contract basis to optimize output and again, primarily to optimize good die out in this environment. So it's great for us given 2/3 of the AGS revenue today is driven by long-term contracts. So we've got really tight relationships with customers, and they're leveraging the footprint that we have in the fab to help them drive output.
매출의 2/3가 장기 계약이고, 90% 후반대 갱신율이죠.
2/3 of the business, long-term contracts and close to high 90s type renewal rates.
공식적으로는 90%+ 갱신율이라고 발표합니다. Portfolio는 꽤 넓어요. Basic level 서비스 — warranty 비슷한 것들 — 부터 managed service, performance service까지. Performance/managed 쪽은 customer와 deep하게 co-optimize하면서 output을 끌어올리는데, 거기 갱신율은 90%보다도 훨씬 더 높습니다. 그 stickiness가 customer에게 제공하는 value 때문에 굉장히 높은 거고요.
약 10~12년 전에 outcome-based service 솔루션으로 pivot했고, 지금 빠르게 성장하고 있습니다.
So we publish at a greater than 90% renewal rate when our portfolio and services is pretty broad. So we have kind of basic level services, warranty-like services. And then we have managed and performance services, which we really co-optimize with customers, how they manage individual tools and we try to drive output. When we look at managed and performance, the renewal rates are actually quite a bit higher even on those levels. So the stickiness of this because of the value that it provides customers is quite high. And this is a change that we pivoted to about, I'd say, 10, 12 years ago, shifting to more of an outcome-based services type solution. And yes, it's growing quite rapidly.
AGS가 전사 매출의 20~22%, 매우 강한 recurring 매출, OPM 30%에 가까운 수준이고요. FY 상반기 YoY +17% 성장 중. 장기 성장 전망을 low double-digit CAGR에서 sustainable mid-teens로 상향하셨죠. 적어도 올해는 더 높을 수 있다고도. 무엇이 높아진 성장 전망의 driver인가요?
Your services franchise, 20%, 22% of the company's total revenue base, very, very strong recurring revenues, as you just articulated, within striking distance of 30% operating margins. Through the first half of your fiscal year, AGS is driving 17% year-over-year growth. You did raise your long-term growth outlook from low double digits sort of percentage CAGR to sustainable annual growth in the mid-teens range, right, and potentially higher at least this first year. What's driving the higher growth outlook?
구성요소별로 보면 — 첫째, 계약 비즈니스가 계속 성장 중이고, 특히 managed/performance 영역이 빠릅니다. 우리가 customer에게 가장 큰 value를 줄 수 있는 영역이거든요. 평균 계약 기간이 현재 2.9년이고, sweet spot은 2.5~3년 사이입니다. Visibility 측면에서 정확히 우리가 원하는 자리에 있어요. Parts, 인력, customer performance 모두 더 잘 planning할 수 있죠.
두 번째, on-demand 비즈니스 — 예비 부품, 일시적 계약 인력 같은. 이건 팩토리 utilization과 더 직접적으로 묶여 있죠. 지금 utilization이 높으니까 on-demand parts가 늘어나고 있고, 그게 단기 추가 부스트를 주고 있습니다.
세 번째, AGS의 software franchise — 잘 안 다루는 부분이에요. MES(Manufacturing Execution System), Smart Factory, SIM 시스템. AMAT가 사실 customer를 위한 factory-level software 최대 공급자입니다. 이 공간은 앞으로 큰 기회예요. 특히 larger market에서 AI, Agentic AI가 일어나고 있는 걸 생각하면. 우리가 customer와 engage하는 새로운 방식이 될 수 있죠.
그래서 세 영역 모두에서 strength를 보고 있고, Gary가 단기적으로는 mid-double-digit 위로 올라갈 수 있다고 말한 이유입니다.
So if we look at the business in the sort of the component parts, so the contract business continues to grow, and it's growing faster in the managed and performance space, which is great. That's exactly what we want with customers because we think that's where we can provide the most value. Those contracts, we are — I think our average contract length at the moment is about 2.9 years. And the sweet spot for us is somewhere in the 2.5 to 3-year range.
So we're kind of right where we want to be from a visibility standpoint. It helps us plan better for parts and people and performance with customers when we're in that range. So that piece of the business, we're very, very happy with. The next component, I would say, is sort of our on-demand business, and that's on-demand spare parts or if people need contracted labor to come in and do some work. That's a little more tied to factory utilization.
The factory utilization is high, we see the on-demand parts going up. So that's driven it up a little bit more in the near term in combination with this continued strength that we see in the services business. And then the third component of the business in AGS, which we don't talk about too much is we have a software franchise in AGS. So the manufacturing execution system, Smart Factory, the SIM system, Applied is actually the largest supplier of factory-level software for customers.
And that's a space that we see a lot of opportunity going forward, particularly as we think about what's happening in the larger market with AI and Agentic AI. So that platform is an opportunity for us to engage with customers in different ways than we have in the past. So we actually see strength in all 3 of those, and that's why we think there's an opportunity. I think Gary mentioned in the near term to be above that mid-double digit for the year.
지난 5~10년간 설치 base는 6~7% CAGR로 성장했는데, 서비스 비즈니스는 11~13% CAGR. 이제 mid-teens 전망. Installed base 증가도 가속화 중이고, attach 비율도 더 높은 value-added solution으로 traction이 좋은 듯합니다. AIx 같은. AGS 성장 전망에 얼마나 기여하는 건가요? 마지막 업데이트 때 tool당 recurring revenue가 5% CAGR로 자라고 있었는데, AIx, remote diagnostics, digital twins 같은 capability 때문에 value capture rate가 실제로 올라갔나요?
Your installed base of tools last 5 to 10 years has been growing at about a 6% to 7% CAGR. Your services business has been growing up until recently, 11% to 13% CAGR. Now you're forecasting mid-teens as we just talked about going forward. Installed base is accelerating. The team is also seeing good traction driving attach to more higher value-added solutions. You talked about things like AIx. I'm wondering how much of this is also contributing to the AGS sort of growth outlook, right? Last, we got an update from the AGS team. Recurring revenue per tool, which is sort of reflective of capturing more value-added capabilities, recurring revenue per tool was growing at about a 5% CAGR. Has this value capture rate actually gone up due to capabilities like AIx, remote diagnostics, digital twins and things like that?
저희는 AGS innovation pipeline이라는 개념으로 봅니다. AIx capability, IMS tool 지원, cobot 등 다양한 capability를 portfolio화해서 customer에게 deploy하죠. 이걸 aggregate하면 customer가 value chain을 따라 올라가는 게 보입니다. 더 많은 managed, performance type 서비스를 사는 쪽으로요. 그만큼 value를 더 얻기 때문이죠.
한 가지 정말 중요한 포인트 — 오늘날 customer들이 advanced node에서 다루는 process window가 정말, 정말 좁다는 점입니다. 그래서 우리 focus는 팹에서 event가 발생할 때마다 (1) corrective maintenance event를 가능한 한 멀리 밀어내고, (2) corrective를 predictive로 옮기는 거예요.
Predictive model이 있으면 — corrective maintenance를 predictive로 옮기면 — customer와 일정을 협의할 수 있죠. Tool을 내리기 가장 좋은 시점을 찾고 다시 올리는. 하지만 basic maintenance만으로는 부족한데, process window가 너무 좁기 때문이에요. 그래서 우리가 만든 게 CROSSMATCH라는 capability입니다. 몇 년 전에 만들었고, BU와 함께 automate했어요. Tool이 down 되기 전에 빠르게 fingerprint를 떠둡니다.
Predictive model 기준이라 정확히 뭘 해야 하는지 알고 있고, training된 인력을 보내서 change하고, tool을 다시 올리고, re-fingerprint하고, process를 다시 re-center합니다. 그러면 maintenance event 사이 시간을 maximum으로 뽑을 수 있어요. 이게 customer 입장에서 정말 중요한데, tool을 조금 더 오래 돌릴 수 있기 때문이죠. 지금 같은 환경에서 'output is king, good die out is king'이거든요. Process window 중심에 있지 않으면 edge die가 평소보다 조금 빨리 떨어져나가는 식이고요. 그래서 customer들이 이 공간 최적화에 우리와 정말 focus해서 일하고 있고, 그게 contract 비즈니스에서 pull을 만들고 있습니다.
Yes. I think the way we look at it is we are — we have an innovation pipeline that we think of in AGS. And this consists of these AIx capabilities, supporting these IMS tools, which are different for customers than an individual tool. And then there are other capabilities, cobots and other things that we kind of have in the portfolio that we can deploy to support customers. So as we aggregate these capabilities, what we see is customers are moving up the value chain with respect to the types of service that they're buying from Applied. So more into managed, more into performance type service because they're getting more value out of it.
The other thing I would say that's really important to consider is the process windows today that our customers are dealing with on these really advanced nodes, whether it's memory or advanced logic, they're really small. I mean they're very tight. So part of our focus the last couple of years has been to find ways that whenever there is an event that happens in the factory, first of all, we want to take corrective maintenance events, extend them out. We want to move corrective to preventive.
And we do that with these predictive models that have been created because the ability to take a corrective maintenance activity, move it into a predictive means that now we can work with a customer to schedule that. So they're with moving through the factory, we can look at where there's an optimal time to take the tool down and bring it back up. But it's not just basic maintenance anymore because the process windows are so tight. So we created a capability that we call CROSSMATCH a number of years ago, and we've automated it in partnership with our business units, and it allows us to do a quick fingerprint of the tool before it goes down for maintenance.
When it's a predictive model, we know exactly what we need to do. So we've got the folks trained to come in and do that change. We bring it back up. We refingerprint it and re-center the process so that you get the maximum amount of time from maintenance event to a maintenance event. And this is incredibly important for customers because it allows them to run the tools a little bit longer. And in this environment, as I mentioned, output is king and good die outer king. So if you're not centered in the process window, maybe your edge die go out a little sooner than they would have in the past. So customers are very focused on working with us to kind of optimize that space, and that's where we're seeing a lot of the pull currently, particularly in the contract business.
Advanced packaging은 산업적으로 비교적 새로운 dynamic이죠. AMAT한테 incremental growth driver고요. EPIC 파트너십 — memory 고객들은 HBM 중심일 거고, TSMC는 2.5D/3.5D advanced packaging 쪽. 오늘은 Broadcom도 발표하셨는데, AVGO도 in-house로 next-gen 2.5D/3.5D advanced packaging 역량 가져갈 계획이 있고요.
이렇게 packaging의 topology가 다양해지면서 AMAT는 그 모든 걸 support하는 tool portfolio를 가졌는데, 이게 AGS 입장에서 service intensity를 어떻게 끌어올리나요? AGS의 새로운 facet of growth인가요?
Got it. We did touch upon advanced packaging. It is a relatively new dynamic for the industry, right? And an incremental growth driver for Applied. We talked a little bit about this, but you mentioned the EPIC partnerships around next-generation advanced packaging development. You have a number of memory customers. Obviously, I think they're focused on things like HBM. But you announced TSMC, which is more the 2.5D, 3.5D advanced packaging. Today, the Applied team announced a partnership with Broadcom, who also has a plan to bring in some in-house capability on next-generation advanced 2.5D, 3.5D advanced packaging architectures. So you've got this plethora of different sort of topologies for packaging, in which case you have a big portfolio of tools that supports all of these like — how does all of this drive service intensity for the package part of the business from an AGS perspective? And is this a new sort of facet of growth for the AGS team as well?
네, 새로운 기회 맞습니다. AMAT는 HBM packaging에서 #1, 3D SoIC에서도 강한 포지션입니다. 그리고 이 두 영역이 packaging 시장에서 가장 빠르게 성장하는 두 곳입니다. 그 tool들이 팹에 들어가면 service 측면에서 새로운 기회가 생기는 거고요.
역사적으로 front-end tool과 back-end tool은 overlap이 거의 없었습니다. 그런데 heterogeneous integration, advanced packaging에서는 front-end requirement와 complexity, sensitivity가 back-end로 이동 중이에요. 그래서 그 customer들이 AMAT한테 service support를 요청하고 있는 겁니다 — 우리가 HVM 환경에서 그 tool들을 어떻게 maintain해야 하는지 이해하고 있으니까요.
이건 정말 초기 단계지만, 장비 비즈니스의 기회에 더해 service 비즈니스에서도 incremental opportunity가 만들어지고 있다고 봅니다.
I think it is a new opportunity for us. I mean we're #1 in packaging in HBM, and we've got a great position in 3D SoIC in particular. And those are the 2 fastest-growing portions of the packaging market as we see it. So as those tools go into factories, it creates a new opportunity for us on service.
Historically, there are sort of front-end tools and back-end tools, and there wasn't a lot of overlap between the 2 of them. With heterogeneous integration, advanced packaging, we're seeing the front-end requirements and that complexity, the sensitivity is moving to the back end. So those customers are looking for support from Applied on the service side because we've got the understanding of how those tools need to be maintained in an HVM environment. So I think we're in the very early stages of this as we see going forward. But I do think it creates an incremental opportunity for us in the service business in addition to the great opportunity that we have on the equipment side of the business.
4월 분기 강한 매출 성장에 더해 GPM이 QoQ +30bps, YoY +120bps 개선됐고 OPM은 +100bps 올라서 29%, 2년 만에 최고치. GPM 개선 중 얼마가 AIx, software suite, remote monitoring 같은 higher value-added 서비스 attach에서 오는지 궁금하고요. OPM 30%까지 가까이 와있는데, 장기 AGS OPM 목표가 low 30%대였던 걸로 기억하는데 그게 여전히 valid한가요?
In addition to the strong revenue growth that your franchise delivered in the April quarter, gross margins improved 30 basis points sequentially, 120 basis points year-over-year. Operating margins grew 100 basis points to 29%. That's the highest level in over 2 years, right? And on the gross margin improvements, how much of this is more attach of some of the higher value-added services offerings like AIx, software suite, remote monitoring, which I assume is gross margin accretive. And on the strong operating margins, you're within striking distance of 30%. And I know the team has historically thought they could drive AGS operating margins longer term into that sort of low 30% range. Is that still kind of the way we should think about the long-term operating margin construct?
두 가지 관점으로 봅니다. Top line은 value creation의 결과, bottom line은 efficiency의 결과.
Top line: customer에게 value를 더 만들수록, good die out이 늘수록, 팹 output이 높아질수록, customer가 우리와 더 많은 service work를 하려 합니다. 이건 customer 팩토리에 deep deep하게 integrate 되어야 하고, communication이 정말 좋아야 하고, 뭘 해야 하는지 perfect alignment가 있어야 가능하죠. Service innovation pipeline에 계속 capability를 넣는 게 top line driver입니다.
Bottom line: efficiency 게임. $6.5B run-rate의 큰 operation인데, 그 인프라가 이미 깔려 있어요. Throughput을 더 흘리면 더 efficient해집니다. 주요 geography마다 continental distribution center가 있는데 세 곳 모두 robotics로 fully automate했어요. 예전엔 모든 part를 손으로 stocking, destocking, packing 했다면, 지금은 60%가 자동입니다. 박스에 들어갈 때까지 'touch-free'에 가깝죠. 그게 material velocity를 올리고, stocking이 더 효율적이며, customer 입장에서도 더 빠르고 정확하게 turnaround됩니다.
Operating margin driver는 결국 efficiency라는 거예요. Utilization이 올라가니까 같은 infrastructure로 더 많은 material을 throughput할 수 있고, infra가 더 efficient해지는 거죠.
Yes. We think about it 2 ways. And you kind of commented on them in your question. I mean the top line growth is really all about value creation for customers. The more value we can create, the more good die out, the higher output from the factories, customers are willing to do more service work with us, which we appreciate. And this really requires deep, deep integration with the customers into their factories, really good communication, complete alignment on what needs to be done in the facilities. So as we continue to put things into the service innovation pipeline, those are things that add value. That's primarily driving the top line.
The bottom line growth is really all about efficiency. I mean we have a pretty big operation, $6.5 billion or so operation on a run rate basis. And it's — that infrastructure is there. And the more that you put through the infrastructure, the more efficient it is. So that's very important. We have continental distribution centers on each of the major geographies. We have 3 of them around the world. They've all been fully automated now with robotics. So where we were touching every part stocking, destocking, packing, now like 60% of that is done automatically.
So it's kind of touch-free until it goes into the box. So that allows us to increase velocity of material through those. It's more efficient from a stocking standpoint for us. And it's better for customers because we can turn things around with higher accuracy and faster.
So we're pretty relentless about looking about how we drive efficiency in the business. And that's really what's going to drive the operating margins for us. So again, we think about it 2 ways. Top line is all about value. Bottom line is all about efficiency, and it's — in this infrastructure. So as utilization has gone up in our customer facilities, we're essentially — it's not the exact same infrastructure because clearly, we're adding, but we're driving a lot more material through that infrastructure, so it's more efficient.
마지막 질문. Semi systems 비즈니스를 오래 책임지셨던 분이니까 거기서 한 질문 드릴게요. 이제 회사가 semi systems GPM을 별도로 disclose하는데, 이게 시장과 우리에게 positive surprise였어요. 거의 GPM 55%, OPM 35%. 지난 2년간 큰 개선이었고, IMS 같은 신규 capability로 인한 value가 driver였다고 봅니다.
새 솔루션 파이프라인을 보시면, next-gen tool들의 incremental gross margin이 더 높은가요? 그리고 efficiency 개선을 통해 systems GPM을 더 끌어올리기 위해 팀이 뭘 하고 있나요?
I see. And for the final question, I am going to tap into your many years of running the — being a part of the semiconductor systems business. And now that the team breaks out your semi systems gross margins, it's been a positive surprise for us and for the market, right? Almost 55% gross margins, 35% operating margins for the systems business, significant improvement over the past 2 years, has been driven, I think, by higher value as you bring new capabilities like IMS to the market. As you look at your pipeline of new solutions, does the incremental system gross margin for your next-generation tools carry higher product gross margins? And what is the team doing to drive better cost efficiencies of your systems, which could also help gross margins for the systems business going forward?
결국 value creation입니다 — customer를 위한. IMS 같은 복잡한 tool 보면, 이건 AMAT만 할 수 있는 unique capability라서 customer 입장에서 high value입니다.
그리고 데이터를 보면, 지난 3개월간 우리가 정말 advanced한 신제품을 5개 출시했어요. Minor change가 아니라 quite advanced한 것들이죠. Trillium이 그 중 하나고, precision tool의 selective nitride deposition, Veeva treatment tool(Master Class에서 다뤘던 것) — 모두 customer가 정말 어려운 문제를 푸는 데 도움이 되는 unique capability라서 high value입니다.
Brice와 Gary 모두 언급했듯, 장기적으로 기술이 evolve하면서 이런 제품들이 mix에서 점점 더 큰 비중을 차지하게 될 것이고, 그건 AMAT 전체 GPM에 beneficial할 거예요.
Sure. I think as you pointed out, this is really all about value creation, value creation for customers. When you look at these complex tools like an IMS tool, it's a unique capability for Applied to be able to do this. And so they're very high value for customers.
The other thing that if you just look at the data today, in the last, I think, 3 months, we released 5 really advanced new products, not just minor changes, but quite advanced, Trillium being one of them. There's a selective nitride deposition on the precision tool. There's a treatment tool for Veeva that was part of the Master Class. These are all unique capabilities that are helping customers solve really difficult problems, so they've got high value.
So we think — as I think Brice and Gary both talked about, long range, as we continue to see more and more of these products moving out as the technology continues to evolve, it's going to be beneficial for Applied overall from a gross margin standpoint.
완벽합니다. 시간이 거의 다 됐네요. Tim, AMAT 전사 high-level 업데이트와 AGS 프랜차이즈에 대한 great insight 감사드립니다.
Perfect. Well, we're just about out of time. Tim, thank you for the update on the high-level overall business of Applied and the great insights on your AGS franchise. Thank you very much.
네, 초대해주셔서 감사합니다, Harlan. 감사합니다.
Yes. Thanks for having, Harlan. Appreciate it.